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July 22, 2017
Brochure
Nanoform Xtc Product
Specifications Page
Contact Us:
Corporate Office:
44 Blackbrook Road
Keene, NH 03431 USA
Tel: 603 357-2511
Fax: 603 358-6174

Why grind...?

Diamond turn tungsten carbide (tc) and other hard-to-machine materials with laser-assisted machining

Why grind tungsten carbide when Precitech and Micro-LAM enable you to diamond turn it?
Diamond turning has many advantages over the conventional grinding method.

With demonstrated feed rates up to 6 mm per minute, the finishing of our standard test part takes less than a minute. Additionally, diamond turning is a deterministic process and well-known techniques can be used to quickly manufacture even complex diffractive (kinoform) molds.

The Nanform Xtc is capable of generating surfaces under 5 nm Sa and 150 nm PV. Compared to traditional grinding, a part requiring minimum post polishing can be made in minutes instead of hours

Also demonstrated to be effective on infrared (IR) materials: Silicon (Si), Zinc Sulfide (ZnS), Calcium Fluoride (CaF2), Germanium (Ge), and Zinc Selenide (ZnSe). Other materials under development: Silicon Carbide (SiC), Sapphire, Glass (BK7).

The µ-LAM patented solution

• The laser beam passes through an optically transparent
  diamond tool
• Innovative solution proven through extensive research
  & development
• Laser delivered precisely at tool-workpiece interface
• Issued patent with 20 claims

  Nanoform® Key Specifications
Turning performance
Surface roughness < 5.0 nm Sa
Form accuracy < 0.15 micron P-V
Programming resolution 0.01 nm linear
Ultimate load capacity 136 Kg (300 lbs) @ 100 PSI
Standard swing capacity 250 mm diameter
Diamond turning of hard material such as tungsten carbide require the superior stiffness of dove tail slides
Precitech’s dove tail slide provides exceptional dynamic stiffness required for diamond turning of hard materials.